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CICC and others set up a venture capital partnership in Xiamen. According to the enterprise search APP, Zhongjin Qiyuan Phase II (Xiamen) Venture Capital Partnership (Limited Partnership) was recently established with a capital contribution of 400 million yuan. Its business scope includes: engaging in equity investment, investment management, asset management and other activities with private equity funds. Enterprise investigation shows that the company is jointly held by CICC Capital Operation Co., Ltd., a wholly-owned subsidiary of CICC.Alibaba Central China Headquarters Project has been put into commercial operation. According to the news of China Construction Eighth Bureau, Alibaba Central China Headquarters Project, which was built by China Construction Eighth Bureau, has been put into commercial operation recently. The project is located in Wuchang District, Wuhan City, Hubei Province, with a total construction area of about 452,200 square meters. The format is mainly commercial complex and office space, consisting of two super-high-rise office towers, commercial podium and four-story basement.Sino-Vietnamese communication is more convenient! The number of entry-exit personnel at Dongxing Port exceeded 8 million. With the continuous optimization of entry-exit policies, the number of entry-exit personnel at Dongxing Port, the border land port with the largest passenger flow between China and Vietnam, exceeded 8 million. According to the statistics of Dongxing Entry-Exit Frontier Inspection Station, the daily average passenger flow at Dongxing Port exceeds 20,000.

Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)Zuckerberg is reported to have donated $1 million to Trump's inauguration fund. Zuckerberg's donation is the latest move to strengthen relations with Trump.Openai: the downtime failures of API, CHATGPT and SORA have been basically fixed. We are monitoring the situation to ensure that the downtime is fully resolved.

Ma Huateng People's Daily wrote: Promote the healthy and sustainable development of the digital economy. Ma Huateng said in the People's Daily that Tencent, as a digital technology enterprise, actively responded to the deployment of the country to expand domestic demand and actively explored the development of digital consumption. By optimizing consumer tools such as WeChat payment, the company tries to create and serve effective demand and promote economic cycle by testing the e-commerce business such as live delivery of water video numbers. At the same time, Tencent relies on the WeChat ecosystem to enhance the absorption and friendliness of employment and entrepreneurship. Last year, it provided employment income opportunities for more than 50 million people. In the future, Tencent will also increase investment, devote itself to technological innovation and industrial upgrading, and jointly contribute to the stable and healthy development of China's economy with the vast number of private enterprises.Minister of Finance Lan Foan attended and delivered a speech at the launching ceremony of the China-World Bank Group Global Ecosystem and Transformation Center. On December 8, the Ministry of Finance and the World Bank jointly held the launching ceremony of the China-World Bank Group Global Ecosystem and Transformation Center (hereinafter referred to as the Global Center). Lan Foan, Minister of Finance, delivered an opening speech with Peng Anjie, President of the World Bank, and signed a memorandum on the Global Center and an agreement on the renewal of the China-World Bank Group Partnership Fund. Liao Minyi, Vice Minister of Finance, and Philo, Vice President of the East Asia and Pacific Region of the World Bank, made closing remarks. More than 100 Chinese and foreign representatives from more than 20 embassies and international organizations in China, as well as relevant domestic departments and research institutions attended the event. Lan Foan emphasized that in the past decade, the central government has invested nearly 6 trillion yuan to fully guarantee the construction of beautiful China. The "gold content" of China's ecological environment has improved significantly, and the "green content" of its development has increased significantly. At the same time, China has assumed the responsibility of a big country, demonstrated its role as a big country, and achieved a major transformation from a participant to a leader in global environmental governance. China is willing to take the global center as a bridge, share China's experience in ecological protection and development, and embark on the road of green transformation together with other countries.Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)